Recently, Realme has launched many models for various groups. And we know many others are in the queue and will hit the market soon. But this is for the first time that we hear anything about the Realme X7. Today, Xu Qi, vice president of Realme and president of global marketing, said through social media that the X7 will use a 120Hz E3 flexible screen and COP packaging process.
Xu Qi said that the smartphone screen has never been just a screen. It is a combination of LCD/OLED/flex cable boards and various IC components. The packaging process of the screen is simply a process technology that solves the layout of the bottom line of the screen. The COP packaging process is to directly bend a part of the soft material OLED screen back in order to further reduce the frame.
In fact, there are only a few models on the market that use this process. The reason is simple – it is а very expensive manufacturing process. Therefore, it increases the phone’s cost.
Currently, Realme has launched three models in the Ministry of Industry and Information Technology, one of which uses a front camera solution with a hole in the upper left corner. The phone model is RMX2176. And documents for the latter show the phone will come with a 2.4GHz octa-core chip. The latter will support dual-mode 5G network. Also, we learned that time that it has a body size of 160.9×74.4×8.1mm, a weigh of 175 grams, and uses a 4200mAh battery.
The Realme X7 series phones will be released on September 1.