MediaTek has introduced its high-end chip the Dimensity 1000+ long ago. The Kirin 1020 is on the way and will be announced before September. So what about Qualcomm? When will this chip maker bring a new flagship mobile platform to the market? Actually, we are more interested in the launch date of new smartphones rather than the announcement date of the Snapdragon 875. But this two are closely related. Today, GSMArena reported that the is chip has started production using TSMC’s 5nm process.
Also Read: MediaTek Dimensity 1000+ Won’t Yield Snapdragon 875
According to reports from Taiwanese media in China, TSMC has already begun to produce Qualcomm’s next-generation flagship chipset, the Snapdragon 875 mobile platform. The company will officially announce the product at the end of this year. And the new chip is expected to appear on high-end smartphones in early 2021.
The Snapdragon 875 mobile platform is being manufactured on the 5nm process node, which should save power, increase manufacturing speed and increase the number of transistors. Unlike the Snapdragon 865 mobile platform, the Snapdragon 875 mobile platform is expected to be equipped with an integrated modem, namely X60 that supports 5G. By the way, the new iPhone 12 series will also use this modem.
The Snapdragon 875 mobile platform will continue to use 1+3+4 CPU. However, this time the Prime core may be the powerful Cortex-X1. The peak performance of X1 is 30% higher than the current A77. Under the same power consumption, it is 20% faster than the A77. Also, at the same performance as the previous product, the power consumption of the Cortex-X1 is 50% less.